Small-diameter single crystal silicon wafers 2 inch 4 inch 6 inch
We can handle silicon substrates using the CZ method/FZ method, from crystal growth to slicing, lapping, etching, polishing, oxidation film, and epitaxy!
Silicon wafers for the doujin industry are produced in domestic factories in Japan and are also manufactured through contract production with Chinese manufacturers. We specialize in all sizes from Φ2", Φ4", Φ6", Φ8", to Φ12". We can also accommodate thermal oxide films, CVD oxide films, SOI, and Silicon on Silicon epitaxy. We are capable of special shape processing such as BG processing (back grinding), dicing, punching, and electrical discharge machining. *We also excel in large-diameter silicon ingots and parts processing (MC processing) up to Φ600mm.
- Company:DOUJINSANGYO Co.,Ltd.
- Price:Other